Executive brief
A memory corruption vulnerability exists in several Qualcomm Snapdragon chipsets used in mobile devices, automotive systems, and industrial IoT equipment. An attacker with local access to a device could potentially cause system instability or gain unauthorized access to sensitive memory areas by exploiting how the hardware processes image commands. This could lead to a partial loss of device confidentiality or availability.
Technical details
An out-of-bounds write (CWE-787) exists in Qualcomm Snapdragon firmware during the parsing of JPEG commands. The vulnerability is caused by unaccounted extra writes to a buffer during validation checks, leading to memory corruption. This is a local attack requiring low privileges, though it has high complexity (AC:H). Successful exploitation allows an attacker to impact the integrity, confidentiality, and availability of the system, potentially crossing security boundaries (Scope: Changed). Affected chipsets include various Snapdragon Mobile, Auto, and Compute platforms.
Affected products
- Qualcomm, Inc. Snapdragon FastConnect 6700, 6900, 7800; G3x Gen 2; IQ9 Series; SA7255P, SA8255P, SA8770P, SD 8 Gen1 5G, and others
Timeline
- 2026-07-06: advisory: Initial disclosure by Qualcomm and NVD publication.